e2v introduces its new ultra low noise interface Integrated Circuit for capacitive sensors

For the French version of this press release please click here.

e2v, the leading designer, developer and manufacturer of specialised components and subsystems, has announced the availability of CPIC2.0, its innovative high-resolution, ultra-low-power and flexible capacitive sensor interface platform integrated circuit.

e2v has now made highly challenging capacitive measurements, with 30aF resolution and a few ?A current consumption, as easy as reading registers.

e2v's Mixed Signal ASIC (MSA) business unit specialises in providing solutions for sensor data acquisition in automotive, medical and industrial markets, specifically for safety and security, energy management and pollution reduction, and health and sport applications.

e2v’s platform Integrated Circuits (ICs) are state-of-the-art analogue front-ends containing all the Interface Platforms (IPs) required to interface a given family of transducers, for example, a dual channel high-resolution Wheatstone bridge, or capacitive transducers.

CPIC2.0 is part of e2v’s platform IC family, dedicated to very-low-power, high resolution measurement of capacitive sensing elements. CPIC2.0 can measure transducers with a base capacitance from 1 to 32 pF. It has a low noise level of 30 aF (1aF = 10-18F), and contains a dual capacitor input enabling several configurations, including ΔCsens / ∑Csens. In addition, it embeds a temperature sensor and an EEPROM for storage of calibration parameters, temperature and pressure compensation and has an easy-to-use microcontroller interface (SPI/TWI). The design can be used for “static” and “dynamic” applications, which require from fewer than 1 up to 166 samples per second.

CPIC2.0 is the perfect choice to interface with MEMS transducers to sense, for example, acceleration, pressure, altitude, humidity, rain, level and gas.

CPIC2.0 is available as a stand-alone device, or populated on a daughterboard for immediate use with e2v’s mixed-signal ASIC development kit, CAPRI2. This kit also includes a motherboard with a companion FPGA (embedding an innovative 32 bits microcontroller IP) for the development of the digital part of the future derivative Mixed Signal ASIC. Hence, deriving an ASIC from this platform is quick and straight forward.

“The CPIC2.0 capacitive platform and its companion CAPRI2 motherboard are very successful plug and play tools for our partners, enabling proof-of-concept and fine tuning of the future ASIC specification before going to the fab " commented Franck Berny, Marketing and Applications Manager at e2v's MSA business unit.

Please contact your local e2v sales office for pricing, datasheet and additional information.

Press contact:
Sylvie Mattei, Communications Manager
Phone: +33 4 76 58 30 25, mailto:sylvie.mattei@e2v.com

NOTES FOR EDITORS:

e2v’s objective is to be a global leader in the design and supply of specialised components and sub-systems that enable the world’s leading systems companies to deliver innovative solutions for medical and science, aerospace and defence, and commercial and industrial markets.

e2v has 4 major product groups:

• High performance electron devices and subsystems for applications including defence electronic countermeasures, radiotherapy cancer treatment, and radar systems
• Advanced Imaging sensors and cameras for applications including industrial process control, dental X-ray systems, space science and life sciences
• Specialist semiconductors, including logic, memory and microprocessors for high reliability mission-critical programs in avionics, defence and telecommunications, sensor data acquisition, and high speed data conversion
• A range of professional sensing products for applications including fire, rescue and security thermal imaging, X-ray spectroscopy, and military surveillance, targeting and guidance

For the year ended 31 March 2008, e2v achieved sales of £205m and is listed on the London Stock Exchange. In October 2008 e2v acquired QP semiconductor, a leading US-based designer and supplier of specialty semiconductor components used in military and aerospace applications, establishing e2v’s first US manufacturing base.

The Company is headquartered in the United Kingdom and has approximately 1800 employees in six production facilities across Europe and North America. e2v also operates a global network of sales and technical support offices, supported by local distributors and resellers.

Further information is available from www.e2v.com